The flexible circuit technology has a proven track record built over twenty years in the military, automotive and computer industries.  FEMMA utilizes this technology to provide price/performance leading, high-density memory platforms required in the Internet Infrastructure and Telecom environments.  

Kentron’s low profile, high density FEMMA technology based memory modules have been widely accepted by system developers for their low thermal properties, high reliability, high density, and leading price/performance position.

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FEMMA  technology is scalable to future chip technologies such as BGA (Ball Grid Array) and Flash.  All components of FEMMA, including the flexible circuits, are placed on the board assembly using today’s standard “pick and place” manufacturing equipment being used by all module manufacturers.