FOR IMMEDIATE RELEASE
Contact Andrea E. Pruna 
Kentron Technologies, Inc.  
978-988-9100, ext. 4161
andrea@kentrontech.com 

KENTRON TECHNOLOGIES ANNOUNCES THE LOWEST PROFILE, NON-STACKED, 1GB DDR MEMORY MODULE IN THE INDUSTRY

Wilmington, MA, (February 7, 2001) – Kentron Technologies (www.kentrontech.com), a leader in advanced memory platforms announced a 1.25-inch high, DDR266, Registered, ECC, 1GB, 184-pin DIMM available for sampling next month. The high-density memory module has been developed utilizing the company’s FEMMA™ (Foldable Electronic Memory Module Assembly), non-stacking, patented technology.
 
This 1.25” FEMMA DDR266 is the latest addition to Kentron’s “The Gig™” family of products. “The Gig” line of products are low profile and available in densities running from 256MB-1GB, they are available in PC133, DDR200 & DDR266 speeds. This line of products has been specifically designed for the 1U low profile servers. These 1U server platforms require components that abide by stringent low height and mechanical footprint constraints. Aware of these limitations, Kentron’s R&D team designed and developed these low profile modules without sacrificing density or speed.

The 1GB, 1.25” FEMMA DDR266 memory module was designed utilizing the company’s FEMMA technology. FEMMA is a proven and reliable, non-stacking memory platform that utilizes dual PCBs connected by a flexible circuit component. The flexible circuit technology has a proven track record built over twenty years in the military, automotive and computer industries. By implementing FEMMA technology in the design of the module, more air space is freed to enhance air circulation in constrained environments; this results in higher overall system reliability. This has been proven in thermal tests performed comparing FEMMA technology to other stacking technologies found in the market place.

“The FEMMA technology eliminates all of the high costs, yield issues and production delays associated with the memory device stacking alternative”, said Bob Goodman, CEO of Kentron Technologies. “With FEMMA technology, high-density solutions in a low profile platform become very affordable to the server and telecom industry.”

The 1GB, 1.25” FEMMA DDR266 will be available for sampling next month.

ABOUT FEMMA TECHNOLOGY
Kentron’s Foldable Electronic Memory Module Assembly (FEMMA) provides a proven and very reliable memory platform utilizing dual PCBs connected by a flexible circuit component. The flexible circuit technology has a proven track record built over twenty years in the military, automotive and computer industries. FEMMA utilizes this technology to provide price/performance leading, high-density memory platforms required in the Internet Infrastructure and Telecom environments. All components of FEMMA, including the flexible circuits, are placed on the board assembly using today’s standard “pick and place” manufacturing equipment being used by all module manufacturers. FEMMA is by nature a much lower cost alternative to the chip stacking method also used for high-density platforms. FEMMA eliminates the high cost of stacking chips, the yield “fall-out” of stacking and the significant time delay of the stacking process. FEMMA is very scalable to next generation DRAM TSSOP and FBGA packages as well as other device technologies including FLASH memory, DSPs, CPUs and other components requiring high-density in a low profile space.

ABOUT KENTRON TECHNOLOGIES
Founded in 1996, Kentron Technologies specializes in the design, engineering and manufacturing of advanced memory products and platforms to meet the speed and density requirements of high performance systems. With patented memory solutions, Kentron is pioneering new technologies that will lay the foundation for future platforms and networks and solve the memory density and speed issues faced by the Internet server and router marketplace. These memory platforms achieve the highest “per socket” densities in the world without the premium costs that might be expected of such leading edge technology.
Kentron manufactures its products in three locations in the United States and maintains a world-class engineering and R&D facility in Massachusetts. Kentron Technologies corporate headquarters is based at 155 West Street in Wilmington. MA.
Attention Editors: for additional information about Kentron Technologies, Inc. please contact Andrea E. Pruna, Kentron Technologies, Inc., Wilmington, MA, at (978) 988-9100, extension 4161, or at andrea@kentrontech.com. Additional information is available at the Company’s website www.kentrontech.com.