FOR IMMEDIATE RELEASE
Contact Andrea E. Pruna 
Kentron Technologies, Inc.  
978-988-9100, ext. 4161
andrea@kentrontech.com 

KENTRON TECHNOLOGIES DELIVERS NEW MEMORY FOR
HIGH-PERFORMANCE NETWORK SERVER MARKET WITH JEDEC STANDARD (1.2” HIGH), NON-STACKED 
1GB MEMORY MODULE

The new 1.2”, registered DIMM utilizes Kentron’s FEMMA technology to deliver a reliable and proven memory solution that avoids the added costs and thermal issues associated with the traditional method of stacking memory devices.

Wilmington, MA, (June 7, 2001) – Kentron Technologies (www.kentrontech.com), a leader in advanced memory platforms has strengthened its position of technology leadership in the memory solution for the server market with the development of a high-density, ultra low profile dual-in-line memory module (DIMM) specifically designed for the 1U internet server marketplace. The new 1.2”, registered DIMM utilizes Kentron’s FEMMA technology to deliver a reliable and proven memory solution that avoids the added costs and thermal issues associated with the traditional method of stacking memory devices.

Following JEDEC Solid State Association’s, the engineering standardization body of the Electronic Industry Alliance, low profile standard height of 1.2” for DIMM modules for the 1U server environment, Kentron’s design team has developed a family of 1GB, ECC, Registered memory modules that meets these height requirements and follows all PC133 and DDR Registered DIMM specifications. The new 1.2” DIMM is scheduled to begin shipping this month to server customers in the industry. These DIMM modules are available in PC133, DDR200 and DDR266 Registered ECC, with densities ranging from 256MB –1GB.

“System manufacturers are developing high-performance 1U systems that require low profile, high density memory modules.  With our patented FEMMA design, we are able to provide the highest density available (1GB) in the lowest profile (1.2"), said Joseph Capaldo, Kentron Technologies’ Product Marketing Manager.  “FEMMA not only meets the height restrictions of the 1U system manufactures, but it also provides, by far, the best price/performance solution by eliminating the high cost of stacking devices and by effectively addressing the thermal issues inside of these space constrained environments,” concluded Capaldo.

Comparative pricing for DDR266, Registered ECC modules is as follows:

In an independent thermal analysis, FEMMA's patented non-stacking technology ran significantly cooler than competing stacking technologies.  FEMMA was designed for those manufactures that require mission critical memory solutions.

ABOUT KENTRON TECHNOLOGIES

Founded in 1996, Kentron Technologies specializes in the design, engineering and manufacturing of advanced memory products and platforms to meet the speed and density requirements of high performance systems.  With patented memory solutions, Kentron is pioneering new technologies that will lay the foundation for future platforms and networks and solve the memory density and speed issues faced by the Internet server and router marketplace. These memory platforms achieve the highest “per socket” densities in the world without the premium costs that might be expected of such leading edge technology. Kentron manufactures its products in three locations in the United States and maintains a world-class engineering and R&D facility in Massachusetts. Kentron Technologies corporate headquarters is based at 155 West Street in Wilmington. MA.

Attention Editors: for additional information about Kentron Technologies, Inc. please contact Andrea E. Pruna, Kentron Technologies, Inc., 155 West Street, Wilmington, MA, at (978) 988-9100, extension 4161, or at andrea@kentrontech.com. 

Attention Investors:  For investor information please contact Vasilios Karabatsos, Kentron Technologies, Inc., 155 West Street, Wilmington, MA, at (978) 988-9100, extension 4120, or at vkarabatsos@kentrontech.com.
Additional information is available at the Company’s website www.kentrontech.com.