FOR IMMEDIATE RELEASE
Contact Andrea E. Pruna 
Kentron Technologies, Inc.  
978-988-9100, ext. 4161
andrea@kentrontech.com  

KENTRON TECHNOLOGIES® INTRODUCES THE INDUSTRY’S FIRST LOW PROFILE (1.125”), HIGH DENSITY (512 MEGABYTE to 2 GIGABYTE) MEMORY MODULE USING THE NEW DDR333 FBGA (FINE-PITCH BALL GRID ARRAY) DEVICE S.

The new 1.125”, FBGA Memory Module utilizes Kentron’s patented FEMMA™ technology  which provides a reliable and proven solution that eliminates the high costs, yield fallout and thermal restrictions associated with stacking memory devices.

Wilmington, MA, (August 15, 2001) – Kentron Technologies (www.kentrontech.com), a leader in advanced memory platforms introduces  a new line of high-density, DDR memory modules based on the next generation FBGA (Fine-pitch Ball Grid Array) DDR packaged devices.  FBGA is the new JEDEC-standard memory packaging solution required for higher speed memory devices.  These new packages move the device connections from metal leads along the side of the device (existing TSOP devices) to ball connections on the underside of the device.  This allows for connections with shorter line lengths from the actual packaged semiconductor die.  At the DRAM package level, there is also a 33-percent reduction affecting both height and width.  The new FBGA device design, however, makes it economically impossible to use the traditional method of “stacking” devices to gain memory density.

Committed to delivering leading edge technologies to its customers, Kentron Technologies’ has expanded its FEMMA family of memory modules to include the new PC2700, FBGA DDR333 memory devices.  Densities will range from 512MB (utilizing 128Mb chips), 1GB (utilizing 256Mb chips) and 2GB (utilizing 512Mb chips).  The new line of modules will have a low profile height of 1.125-inches required by the new very thin (“Hyperdense”, “1U” and “Blade”) server and telecom solutions.  FBGA FEMMA modules will be available in Registered configurations with ECC.

Improved heat dissipation is one key factor in the new FBGA FEMMA modules. FEMMA is a patented, non-stacking, high density memory solution that not only meets the height restrictions of constrained spaces, but it also provides the best price/performance solution by eliminating the high cost of stacking devices.   Additionally, the FEMMA TSOP design has proven in independent studies, to be a better heat dissipater than the alternative stacking method. 

“Kentron’s FEMMA technology is enabling the system and telecom OEMs to meet their density, price and performance goals for memory with a proven and reliable method of incorporating the new FBGA memory devices,” said Chris Karabatsos, President & Chief Technology Officer of Kentron Technologies. “With FEMMA module technology, the high speeds and reliability elements essential to the FBGA devices are met, and the challenges of developing alternative stacking technologies for FBGA are eliminated”, concluded Karabatsos.

FEMMA was designed for those manufactures that require mission critical memory solutions. The PC2700 1.125-inch high, FEMMA FBGA memory modules will be available for sampling in Q4, 2001.

ABOUT KENTRON TECHNOLOGIES
Founded in 1996, Kentron Technologies specializes in the design, engineering and manufacturing of advanced memory products and platforms to meet the speed and density requirements of high performance systems.  With patented memory solutions, Kentron is pioneering new technologies that will lay the foundation for future platforms and networks and solve the memory density and speed issues faced by the Internet server and router marketplace. These memory platforms achieve the highest “per socket” densities in the world without the premium costs that might be expected of such leading edge technology. Kentron manufactures its products in three locations in the United States and maintains a world-class engineering and R&D facility in Massachusetts. Kentron Technologies corporate headquarters is based at 155 West Street in Wilmington. MA.

Attention Editors: for additional information about Kentron Technologies, Inc. please contact Andrea E. Pruna, Kentron Technologies, Inc., 155 West Street, Wilmington, MA, at (978) 988-9100, extension 4161, or at andrea@kentrontech.com. 

Attention Investors:  For investor information please contact Vasilios Karabatsos, Kentron Technologies, Inc., 155 West Street, Wilmington, MA, at (978) 988-9100, extension 4120, or at vkarabatsos@kentrontech.com.
Additional information is available at the Company’s website www.kentrontech.com .

Kentron Technologies and FEMMA are Trademarks of Kentron Technologies. All other trademarks are property of their respective owners.