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December 6, 2001
KENTRON TECHNOLOGIES® ANNOUNCES DDR BASED QUAD BAND MEMORY® (QBM) ROADMAP THROUGH 2005.
QBM technology uses today’s existing, low cost DDR SDRAM memory devices to double the memory bandwidth to the highest in the industry and provide balance for years to come with the fastest system processors.
November 15, 2001.
KENTRON TECHNOLOGIES LAUNCHES INTERNATIONAL ALLIANCE FOR IMPLEMENTATION OF "QUAD BAND MEMORY" (QBM™) TECHNOLOGY
QBM technology uses today’s existing DDR SDRAM memory devices to double the memory bandwidth to the highest in the industry and provide balance with the fastest system processors.
November 13, 2001.
KENTRON TECHNOLOGIES® IS THE FIRST TO BE APPROVED FOR A LOW PROFILE, 1GB DDR MEMORY MODULE ON THE SERVERWORKS GRAND CHAMPION™ HE ARCHITECTURE PLATFORMS
FEMMA Technology and the ServerWorks Grand Champion HE platform make a winning combination.
October 10, 2001
CMTL
(COMPUTER MEMORY TEST LABS) APPROVES KENTRON TECHNOLOGIES 1-GB, LOW PROFILE,
133-MHz, REGISTERED, ECC DIMM for INTEL/STL2 (TUPELO) MOTHERBOARD
A new CMTL-certified 1-GB, PC133 Dual In-Line Memory Module (DIMM) for 1U, hyper
dense and blade server applications is now available from Kentron Technologies.
September
26, 2001
KENTRON
TECHNOLOGIES® ANNOUNCES THAT IT HAS LICENSED ITS ADVANCED FEMMA™ MEMORY
TECHNOLOGY TO AVANT TECHNOLOGY
Avant technology will be able to take advantage of this FEMMA license to
manufacture and sell low-profile, high density memory modules, which
are highly
demanded, by the growing “1U”, “blade” and “hyper dense” server
marketplace.
August 15, 2001.
KENTRON
TECHNOLOGIES® INTRODUCES THE INDUSTRY’S FIRST LOW PROFILE (1.125”), HIGH
DENSITY (512 MEGABYTE to 2 GIGABYTE) MEMORY MODULE USING THE NEW DDR333 FBGA
(FINE-PITCH BALL GRID ARRAY) DEVICES.
The new 1.125”, FBGA Memory Module utilizes Kentron’s
patented FEMMA™ technology which provides a reliable and proven solution
that eliminates the high costs, yield fallout and thermal restrictions
associated with stacking memory devices.
June 27, 2001.
KENTRON
TECHNOLOGIES RECEIVES THE FIRST 1GB, DDR266 MEMORY MODULE APPROVAL FROM TYAN
COMPUTER FOR THE DUAL ATHLON BASED, THUNDER K7 S2462 MOTHERBOARD.
Kentron Technologies Passes Advanced Testing On Tyan, Dual
Athlon Based, Thunder K7 S2462 Motherboard With Its Innovative Low Profile
(1.2-Inch) Registered 1GB and 512MB High Density FEMMA™ DDR Modules.
June 20, 2001.
KENTRON
TECHNOLOGIES ANNOUNCES THAT IT HAS LICENSED ITS ADVANCED FEMMA™ AND LOW
PROFILE MEMORY TECHNOLOGIES TO PERIPHERAL ENHANCEMENTS
.
The licensing agreement provides Peripheral Enhancements with Kentron’s leading memory
technology, which enables them to now build and sell high density,
cost-efficient, reliable memory modules utilizing FEMMA technology.
June 7, 2001
KENTRON
TECHNOLOGIES DELIVERS NEW MEMORY FOR HIGH-PERFORMANCE NETWORK SERVER MARKET WITH
JEDEC STANDARD (1.2” HIGH), NON-STACKED 1GB MEMORY MODULE.
The
new 1.2”, registered DIMM utilizes Kentron’s FEMMA technology to deliver a
reliable and proven memory solution that avoids the added costs and thermal
issues associated with the traditional method of stacking memory devices.
March 14, 2001
KENTRON
TECHNOLOGIES IS SAMPLING A 512MB SODIMM
Built using FEMMA technology, Kentron has achieved the highest density
SODIMM available in the marketplace.
February 26, 2001
KENTRON
TECHNOLOGIES SHOWCASES INNOVATIVE QBM (QUAD BAND MEMORY TECHNOLOGY) TO DOUBLE
THE BANDWIDTH OF DDR MEMORY DEVICES AT THE INTEL DEVELOPER FORUM, SPRING 2001.
QBM is a technology that doubles the bandwidth of today’s fastest memory ICs.
The demonstration will take place at Kentron’s booth (No. 828) at the Intel
Developer Forum, February 26 – March 1, 2001 at the San Jose Convention
Center.
February 7, 2001
KENTRON
TECHNOLOGIES ANNOUNCES THE LOWEST PROFILE, NON-STACKED, 1GB DDR MEMORY MODULE IN
THE INDUSTRY.
This 1.25” FEMMA DDR266 is the latest addition to Kentron’s “The Gig™”
family of products. “The Gig” line of products are low profile and
available in densities running from 256MB-1GB, they are available in PC133,
DDR200 & DDR266 speeds. This line of products has been specifically
designed for the 1U low profile servers.
January 25, 2001
KENTRON
TECHNOLOGIES NAMES QUENTIN LEWIS, DIRECTOR OF ENGINEERING.
Lewis will draw
on more than 20 years of product development & engineering leadership
experience to contribute to the development of present and future technologies
within the company.
Press Releases
2002
Press Releases 2001
Press Releases 2000
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