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December 4, 2002
KENTRON TECHNOLOGIES INC. ANNOUNCES THE ADOPTION OF DDRI-400 DRAM DEVICES TO SUPPORT QUAD BAND MEMORY (QBM) 800MHZ MODULES FOR SINGLE AND DUAL MEMORY CHANNEL SYSTEMS.
The combination of DDRI-400 devices and the QBM module based technology provides systems with memory solutions in 2003 that deliver the highest system performance (6.4 GB/sec and 12.8 GB/sec) in the industry.
November 14, 2002
THE QBM ALLIANCE WELCOMES NEW MEMBERS, ATP ELECTRONICS & TANISYS TECHNOLOGY.
As alliance members, ATP and Tanisys will receive priority resources from Kentron that include QBM modules, simulation models, design guides, technical documentation, and engineering support for technology evaluation and product implementation.
September 17, 2002
KENTRON TECHNOLOGIES, INC., ANNOUNCES THAT VIA TECHNOLOGIES, INC AND S3 GRAPHICS, INC HAVE LICENSED THE DDR BASED, QUAD BAND MEMORY (QBM) TECHNOLOGY.
The QBM technology effectively doubles the bandwidth of DDR SDRAM, and when incorporated into leading chipsets from VIA and S3 Graphics, will deliver higher PC performance through evolutionary memory technology.
July 19, 2002
KENTRON TECHNOLOGIES' FIRST TO MARKET WITH DDR333, LOW-PROFILE 1GB REGISTERED DIMMS.
This high density module has been specifically designed to meet the marketplace need for reliable high density, high speed memory modules.
June 13, 2002.
THE QBM ALLIANCE, FOUNDED BY KENTRON TECHNOLOGIES, WELCOMES ACUID CORPORATION AS A NEW MEMBER OF THE ALLIANCE.
Acuid Corporation provides test equipment to the semiconductor and memory module industry and will be instrumental in the testing of the QBM modules being introduced later this year.
June 6, 2002.
KENTRON TECHNOLOGIES® ANNOUNCES ROYALTY FREE LICENSE STRATEGY FOR BOTH QBM™ AND FEMMA™ TECHNOLOGIES
Interested companies will have access to gerbers, design guides and the tools that they will need for development
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February 14, 2002.
THE QUAD BAND MEMORY (QBM) ALLIANCE ANNOUNCES THE ADDITION OF CST, INC. AND NETLIST, INC. TO THE GROWING MEMBERSHIP ROSTER -
The need for speed is evident, as design engineers try to reduce the widening gap between microprocessor performance and memory performance, more commonly called the "Memory Wall".
January 31, 2002
KENTRON TECHNOLOGIES® FIRST TO MARKET WITH LOW-PROFILE, HIGH-DENSITY DDR200/266, 256MB, 512MB & 1GB SODIMM SUPPORTING ECC FUNCTION-
These high density modules are specifically designed for the blade and Hyperdense servers, as well as for laptop, Compact PCI systems and mobile Internet applications.
January 16, 2002
THE QBM ALLIANCE ANNOUNCES THAT SILICON INTEGRATED SYSTEMS CORP. (SiS) HAS JOINED THE ALLIANCE -
"As a leading chipset supplier, SiS is poised to offer the best price/performance products to the market. By being a member of the QBM Alliance, SiS further extends her capability to deliver on such a commitment," said Shing Wong, Senior Vice President of SiS.
Press Releases
2002
Press Releases 2001
Press Releases 2000
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