Wilmington, MA (March 6, 2000) – Kentron Technologies, Inc., a leading designer and manufacturer of high-density memory products, announced today the launching of its 1-Gigabyte memory module utilizing its patented FEMMA^TM Technology.

Kentron Technologies has achieved a high capacity memory module that is a PC-100, PC-133 SDRAM Registered DIMM. The module is comprised of 256-Megabit SDRAM chips. Kentron offers other configurations of its high-density memory modules as a 256-Megabyte and a 512-Megabyte module, all based on its patented FEMMA technology. Kentron’s 1 Gigabyte module is currently tested by large DRAM manufacturers in the multi way processor systems released by Intel. It allows such systems to reach memory densities of 32 Gigabytes of high performance memory in 32 slots. Fully populated systems with 32 Gigabytes have been under test by OEMs and system designers incorporating the Intel multiprocessor chipset.

"The 1 gigabyte module accomplishes the highest density per connector. It has a height of 1.5" low profile, excellent thermal characteristics and high speed at a low cost" stated Chris Karabatsos, President and Chief Technical Officer at Kentron Technologies, Inc. "The market is now ready for this solution and Kentron is prepared to meet the increasing worldwide demand for its high density memory modules" concluded Karabatsos.

The 1-Gigabyte high-density memory module is another example of Kentron’s continued commitment to provide leading products to meet its customer’s requirements.