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FOR IMMEDIATE RELEASE
Contact Andrea E. Pruna
Kentron Technologies, Inc.
978-988-9100, ext. 4161;
e-mail: andrea@kentrontech.com
KENTRON TECHNOLOGIES ANNOUNCES AVAILABILITY OF PC 100/133 COMPLIANT
ULTRA-LOW PROFILE SODIMM
Wilmington, MA, (April 25, 2000)
– Kentron Technologies, a leader in
next generation memory architectures announced today the availability of
its 1.03 inch SODIMM memory module compliant with PC100/133
specifications. The new ultra-low profile SODIMM module is scalable to
next generation memory chip speeds and densities.
Kentron Technologies has achieved the lowest profile SODIMM available
in the market today. The SODIMM achieves densities up to 256 MB using 256
Mb SDRAM in a 400mil TSOPII package. It
was designed to meet PC100/133 specifications. Kentron’s customers were
pleased to see the SODIMM pass stringent tests, outperforming other
SODIMMs in the market by running up to 166Mhz.
Kentron is targeting this low profile SODIMM module for laptop and
mobile internet applications where space constraint is an issue.
Electronic designers of such applications try to fit the greatest amount
of components in the smallest possible space. Most SODIMM modules
available in the market today have a height of 1 ¼". Kentron’s
1.03" scalable SODIMM will help to address space constraints without
sacrificing speed. The 1.03" SODIMM will be available next month for
sampling.
"It was a great challenge for the design team to
achieve such a low profile solution that will run at such speeds"
stated Badawi Dweik, Product Engineering Manager at Kentron Technologies.
"Our continuing mission is to understand the industry needs, and to
provide innovative solutions to meet the requirements".
The scalable 1.03" SODIMM memory module is another
example of Kentron’s continued commitment to provide leading products to
meet its customer’s requirements, while developing next generation
memory devices.
ABOUT
KENTRON TECHNOLOGIES, INC.
Kentron Technologies, Inc. specializes in the design, engineering and
manufacturing of high density present and next generation memory products
and architectures to meet the speed and density requirements of high
performance systems. The Company follows an overall system approach from
CPU, to chipset, to system bus for engineering present and next generation
high-density memory solutions. Kentron provides engineering and
manufacturing support at every phase of the customer’s product life
cycle. Additional information about Kentron Technologies, Inc. is
available at the Company’s website www.kentrontech.com.
For more information about Kentron Technologies and its
products, please contact Andrea E. Pruna, Kentron Technologies, Inc.,
Wilmington, MA, at 978-988-9100, extension 4161, or at andrea@kentrontech.com
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