FOR IMMEDIATE RELEASE
Contact Andrea E. Pruna 
Kentron Technologies, Inc.  
978-988-9100, ext. 4161
andrea@kentrontech.com 

KENTRON TECHNOLOGIES ANNOUNCES "THE GIG" A 1.25-INCH HIGH, PC133, 1GB FEMMA MEMORY MODULE, LOWEST PROFILE AVAILABLE IN THE MARKETPLACE TODAY 
Kentron has accomplished the design of a module with the highest density (1GB) and the lowest height (1.25") available in the market place today.

Wilmington, MA, (Thursday, December 7, 2000) - Kentron Technologies (www.kentrontech.com), a leader in advanced memory platforms announced "The Gig", the lowest profile solution for 1U servers and platforms in the marketplace. "The Gig" is a 1.25" high, PC133, Registered, ECC, 1GB, 168-pin memory module developed utilizing its patented FEMMA technology. FEMMA is a proven cost effective, non-stacking approach to high-density memory. With this new design, Kentron has accomplished the design of a module with the highest density (1GB) and the lowest height (1.25") available in the market place today.

Through a unique layout of the components that compose a memory module (TSSOP device SDRAM, registers, PLL, etc.), Kentron's team of design engineers reduced the height of the module by 26% from the industry standard 1.7" to 1.25", while still maintaining all industry standards for PC133. The 1.25", 1GB FEMMA module is the latest innovation in Kentron's family of high density, high-speed 1GB memory platforms better known as "The Gig". "The Gig" allows system designers to maximize memory densities in today's space constrained environments.

The 1.25" FEMMA module has been especially designed to work in the 1U server platforms, which require ultra-low profile memory modules to fit in these tighter spaces. Kentron has taken advantage of its FEMMA technology to offer the industry a product that delivers a reduction in height of 0.45" with the capability of achieving densities up to 1GB of memory utilizing today's 256-Mbit SDRAM chips. As memory density at the chip level move to 512Mb and 1Gb, Kentron's FEMMA platform will provide 2GB and 4GB platform solutions. FEMMA is also an excellent solution that breaks the density ceiling (512MB) being faced by the new unstackable Ball Grid Array (FBGA) devices. FEMMA with FBGA will provide even lower profile modules at the higher 1GB, etc. density levels.

"The power of the FEMMA platform is in its great flexibility," said Bob Goodman, Kentron Technologies CEO. "FEMMA is a proven technology that effectively addresses the need for high-density memory while eliminating all the high costs and time delays associated with the alternative memory device stacking techniques. This new low-profile version of FEMMA that we call "The GIG" is already being received as THE solution for the 1U server marketplace."

The 1.25" high, PC133, registered, ECC, 1GB, 168-pin FEMMA memory module will be available for sampling in January 2001.

ABOUT FEMMA TECHNOLOGY 
Kentron's Foldable Electronic Memory Module Assembly (FEMMA) provides a proven and very reliable memory platform utilizing dual PCBs connected by a flexible circuit component. The flexible circuit technology has a proven track record built over twenty years in the military, automotive and computer industries. FEMMA utilizes this technology to provide price/performance leading, high-density memory platforms required in the Internet Infrastructure and Telecom environments. All components of FEMMA, including the flexible circuits, are placed on the board assembly using today's standard "pick and place" manufacturing equipment being used by all module manufacturers. FEMMA is by nature a much lower cost alternative to the chip stacking method also used for high-density platforms. FEMMA eliminates the high cost of stacking chips, the yield "fall-out" of stacking and the significant time delay of the stacking process. FEMMA is very scalable to next generation DRAM TSSOP and FBGA packages as well as other device technologies including FLASH memory, DSPs, CPUs and other components requiring high-density in a low profile space.

ABOUT KENTRON TECHNOLOGIES 
Founded in 1996, Kentron Technologies specializes in the design, engineering and manufacturing of high density present and next-generation memory products and platforms to meet the speed and density requirements of high performance systems. With patented memory solutions, Kentron is pioneering new technologies that will lay the foundation for future platforms and networks and solve the memory density and speed issues faced by the Internet server and router marketplace. These memory platforms achieve the highest "per socket" densities in the world without the premium costs that might be expected of such leading edge technology. Kentron manufactures its products in three locations in the United States and maintains a world-class engineering and R&D facility in Massachusetts. 
Kentron Technologies corporate headquarters is based at 155 West Street in Wilmington. MA.

Attention Editors: For additional information about Kentron Technologies, Inc. please contact Andrea E. Pruna, Kentron Technologies, Inc., Wilmington, MA, at (978) 988-9100, extension 4161, or at andrea@kentrontech.com. Additional information is available at the Company's website www.kentrontech.com.